Title : Additive manufacturing of metallic structures by laser-induced forward transfer
Abstract:
The utilization of laser-induced forward transfer (LIFT) in additive manufacturing presents a promising avenue for the precise development of metallic structures on flexible substrates. Despite its notable advantages, including being a contactless and nozzle-free process facilitating the rapid fabrication of 3D structures, LIFT faces challenges such as shockwave generation, poor adhesion to receiver substrates, and issues with uniform depositions. This research addresses these limitations by proposing effective solutions for their mitigation. To enhance the LIFT process, receiver surface modifications and low-pressure conditions are introduced through laser surface texturing (LST) coupled with a vacuum pump. Exploring various textures and orientations in LST aids in determining the optimal conditions for copper (Cu) deposition. The innovative approach of utilizing the same laser system for both LST and LIFT contributes to the cost-effectiveness and efficiency of the manufacturing process. Beyond copper (Cu) depositions, this research incorporates additive layers of silver (Ag) and platinum (Pt). The subsequent fabrication of Ag and Pt micropillars on their respective additive layers leads to the formation of Cu-Ag and Cu-Pt alloy structures. Electrical and material characterizations validate the potential applications of these structures, revealing enhanced adhesion with electrical properties for LST-based LIFT under low-pressure conditions. Finally, an in-depth energy analysis, employing theoretical and finite element methods (FEM), provides valuable insights into the mechanics of the LIFT process, further contributing to the understanding and advancement of this additive manufacturing technique.
Audience Take Away Notes:
- Optimizing Deposition Parameters: The audience will learn about the investigation of various textures and orientations through laser surface texturing (LST) to determine the optimal conditions for copper (Cu) deposition using laser-induced forward transfer (LIFT)
- Diverse Alloy Structure Formation: The audience will learn about the successful fabrication of Cu-Ag and Cu-Pt alloys structures by depositing additive layers of silver (Ag) and platinum (Pt) in addition to copper (Cu) using the developed methodology
- Enhanced Adhesion and Electrical Properties: Experimental evidence demonstrating enhanced adhesion and improved electrical properties for LST-based LIFT under low-pressure conditions will be presented, providing valuable insights into the potential applications of the developed technique
