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9th Edition of

International Conference on Materials Science and Engineering

March 23-25, 2026 | Singapore

Materials 2026

Solid state UV cross-linking for advanced manufacturing

Speaker at International Conference on Materials Science and Engineering 2026 - Huang WM
Nanyang Technological University, Singapore
Title : Solid state UV cross-linking for advanced manufacturing

Abstract:

In this talk, a novel solid-state UV cross-linking based advanced manufacturing technology is introduced, offering a transformative approach to additive manufacturing and materials processing. Unlike conventional UV-curing methods that rely on liquid-phase resins, this technique enables cross-linking of materials directly in their solid state, allowing for enhanced control, stability, and versatility in fabrication processes. A variety of materials are explored, including those that are commercially available as well as those derived or modified from commercial precursors, to demonstrate their feasibility for solid-state UV activation. The selection criteria for these materials are discussed, with a focus on their photoreactivity, mechanical properties post-curing, and compatibility with UV irradiation in the solid phase.

The advantages of solid-state UV cross-linking over traditional liquid-based methods are significant. These include reduced material flow and spreading during exposure, improved spatial resolution, minimized shrinkage, and the ability to pre-shape or pre-assemble materials prior to curing. Such capabilities are especially advantageous in applications requiring high structural precision and complex geometries.

Several application scenarios are presented to showcase the potential of this technology in advanced manufacturing. Particular emphasis is placed on its role in rapid volumetric additive manufacturing, where the ability to initiate cross-linking volumetrically and simultaneously enables ultrafast fabrication of complex three-dimensional objects. This represents a breakthrough in speed and scalability, with potential applications in biomedical devices, micro-optics, electronics, and structural materials. Overall, solid-state UV cross-linking opens new opportunities for additive manufacturing with greater precision, material diversity, and functional integration.

Biography:

Dr Wei Min Huang is currently an Associate Professor at the School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore. With over 30 years of experience on various shape memory materials (alloys, polymers, composites and hybrids), he has published over 200 papers in journals, such as Materials Today, Accounts of Chemical Research, and Advanced Drug Delivery Reviews, and has been invited to review manuscripts from over 300 international journals (including Progress in Polymer Science, Nature Communications, Advanced Materials, and Advanced Functional Materials, etc), project proposals from American Chemical Society, Hong Kong Research Grants Council, etc, and book proposals from Springer, Elsevier  and CRC. He has published two books (Thin film shape memory alloys – fundamentals and device applications, Polyurethane shape memory polymers) and is currently on the editorial board of four dozen of journals. He holds over 50 granted patents in China, USA, Singapore and Europe.

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