The process of collecting and evaluating data to establish the reason of a failure, usually with the objective of determining corrective actions or liabilities, is known as failure analysis. It is a significant discipline in many fields of the manufacturing industry, such as the electronics industry, where it is a crucial tool for developing new products and improving old ones. The failure analysis process begins with the collection of failed components, which are then examined using a variety of technologies, including microscopy, to determine the cause or reasons of failure.
Failure analysis can be used as a technique for both prevention and troubleshooting in the development of new products and the refinement of current ones. To avoid product failures, there are two strategies that can be applied, Fault Tree Analysis (FTA) and Failure Modes Effects Analysis (FMEA).
Title : A proposal of chemical sensor based on polycrystalline Cu2O nanofilm
Paulo Cesar De Morais, Catholic University of Brasilia, Brazil
Title : Plant-mediated synthesis of silver nanoparticles and zinc oxide nanoparticles and application of AgNPs for the development of antimicrobial biopolymer films in food packaging
Garva Anup Karmarkar, Vishwakarma Institute of Technology, India
Title : Thermodynamic analysis of a combined modified Kalina–GT-MHR cycle with porous medium effects
Rakesh Manilal Harjivandas Patel, Government Science College, Gandhinagar, India
Title : Non-newtonian rheology on curved circular squeeze films using the Rabinowitsch fluid model
Rakesh Manilal Harjivandas Patel, Government Science College, Gandhinagar, India
Title : Ferrofluid mediated synthesis of nanomagnetic polymer materials in supercritical fluids
M G H Zaidi, G B Pant University of Agriculture & Technology, India
Title : Shape memory phenomena and twinning-detwinning reactions and crystallographic transformations in shape memory alloys
Osman Adiguzel, Firat University, Turkey