The process of collecting and evaluating data to establish the reason of a failure, usually with the objective of determining corrective actions or liabilities, is known as failure analysis. It is a significant discipline in many fields of the manufacturing industry, such as the electronics industry, where it is a crucial tool for developing new products and improving old ones. The failure analysis process begins with the collection of failed components, which are then examined using a variety of technologies, including microscopy, to determine the cause or reasons of failure.
Failure analysis can be used as a technique for both prevention and troubleshooting in the development of new products and the refinement of current ones. To avoid product failures, there are two strategies that can be applied, Fault Tree Analysis (FTA) and Failure Modes Effects Analysis (FMEA).
Title : Reconstruction of dislocation core structures for aluminum
Yan Huang, Brunel University, United Kingdom
Title : Birth of solids: In situ liquid STEM to reveal the earlier stage of growth of nanocrystals
Walid Dachraoui, Swiss Federal Laboratories for Materials Science and Technology, Switzerland
Title : Improving the surface properties of materials and biomaterials by electrochemical methods.
Lidia Benea, Dunarea de Jos University of Galati, Romania
Title : Oxygen vacancies based modifications in properties of Sr doped Nd2NiMnO6
Khalid Sultan, Central University of Kashmir, India
Title : Role of various factors in single point diamond turning machining (SPDT) to manufacture superhydrophobic surfaces
Jaishree Sharma, University of Petroleum and Energy Studies, India
Title : Assessing and prioritizing demolition waste management scenarios using a BIM-based life cycle sustainability assessment (LCSA) and multi-criteria decision aiding method
Dongchen Han, University of Melbourne, Australia