Abstract:
The fundamentals of a body of knowledge that could be identified as fiber optics structural analysis (FOSA) are addressed. The emphasis is on the application of analytical ("mathematical") predictive modeling, as well as on the probabilistic design for reliability (PDfR) of fiber optics structures. Optical fibers subjected to thermal and/or mechanical loading (stresses) in bending, tension, compression, or to the combinations of such loadings are considered. The addressed structures include, but are not limited to, optical fibers of finite length: bare fibers; jacketed and dual-coated fibers; fibers experiencing thermal loading; fibers soldered into ferrules or adhesively bonded into capillaries. The roles of geometric and material non-linearity; dynamic response to shocks and vibrations; and possible applications of nano-materials in new generations of coating and cladding systems are addressed. The PDfR part of the presentation is concerned with a novel, fruitful and challenging direction- probabilistic modeling of the states of stress and strains and the useful lifetime of electronic, opto-electronic and photonic products and particularly optical fibers and interconnects. The rationale behind the PDfR concept is that the probability of failure is never zero, but could be predicted and made adequate for a particular product and application. It is concluded that the application of the methods and approaches of FOSA can be very helpful, in addition to the computer simulation and experimental efforts, in creating a viable and reliable fiber optics product and that the PDfR approach enables designing and fabricating a viable and reliable optoelectronic product with the predicted, assured and even, when appropriate, specified adequate probability and the useful lifetime of a photonic product.
Biography:
Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, and Bordeaux Univ., France. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA, is Foreign Full Member of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 500+ publications, presented numerous plenary, keynote, invited and contributed talks and taught continued education courses worldwide. He received many professional awards, including 1996 Bell Labs. Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”). He is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. Ephraim's most recent awards are 2023 SHEN International Research Award on Science, Health and Engineering" for the paper "Probabilistic Fitts' Law and the Likelihod of the Tunguska Type of Event", Journal of Space Safety Engineering, 10(1), March 2023"; 2019 IEEE Electronic Packaging Society (EPS) Field award (for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems); 2019 IMAPS Lifetime Achievement award (for making exceptional, visible, and sustained impact on the microelectronics packaging industry and technology) and 2022 IEEE SCV Section Outstanding Engineer award (for seminal contributions to several critical IEEE fields, including probabilistic design-for-reliability of microelectronic and photonic materials, devices and systems, and the role of the human factor).
