Failure analysis is the process of gathering and evaluating data to identify the root cause of a failure, frequently with the aim of establishing responsibility or corrective measures. Machine failures, in the words of Bloch and Geitner, "show a response chain of cause and effect... often a deficit frequently referred to as the symptom". If done appropriately and used, failure analysis may conserve resources, money, and even lives. It is a significant discipline in many sectors of the manufacturing sector, including the electronics sector, where it is an essential instrument for the creation of new goods and the enhancement of already-existing ones. In order to determine the reason or causes of failure utilising a variety of specifically spectroscopy and microscopy, as approaches. Because the failing goods are unaffected by analysis, inspections may begin employing nondestructive testing NDT techniques such as industrial computed tomography scanning tools and techniques, the failure analysis method depends on gathering failed components.
Title : Application of vanadium and tantalum single-site zeolite catalysts in heterogeneous catalysis
Stanislaw Dzwigaj, Sorbonne University, France
Title : Developing novel sensing platforms using nanostructures
Harry Ruda, University of Toronto, Canada
Title : Solid state UV cross-linking for advanced manufacturing
Huang WM, Nanyang Technological University, Singapore
Title : The effect of substitution of Mn by Pd on the structure and thermomagnetic properties of the Mn1−xPdxCoGe alloys (where x = 0.03, 0.05, 0.07 and 0.1)
Piotr Gebara, Czestochowa University of Technology, Poland
Title : Evaluation of mineral jelly as suitable waterproofing material for ammonium nitrate
Ramdas Sawleram Damse, HEMRL, India
Title : The role of tunable materials in next-gen reconfigurable antenna design
Nasimuddin, Institute for Infocomm Research, A-STAR, Singapore