Hybrid eventIn-person & virtual
March 18–20, 2027Singapore · Village Hotel Changi
Session Track · Materials 2027

Nanoindentation at Materials 2027

Part of the Materials 2027 scientific programme · Village Hotel Changi, Singapore · March 18–20, 2027

About the Nanoindentation Session

A number of indentation hardness tests are used on tiny volumes during nanoindentation, also known as instrumented indentation testing. Perhaps the most used method for evaluating a material's mechanical characteristics is indentation. The mid-1970s saw the development of the nanoindentation technology, which was used to gauge the hardness of tiny amounts of material. A hard point with known mechanical characteristics sometimes made of an extremely hard material like diamond is pushed into a sample whose mechanical properties are unknown in a typical indentation test macro or micro indentation. As the indenter tip burrows further into the specimen, the weight applied to it rises until it quickly reaches a user-defined value. The burden may now be kept steady for a while or eliminated. The indentation area in nanoindentation may only be a few square micrometres or even nanometers due to the utilisation of minuscule loads and tip sizes. As a result, it is difficult to locate the contact region while assessing the hardness. The indentation may be imaged using atomic force microscopy or scanning electron microscopy techniques, although these methods can be time-consuming. Instead, an indenter with a well-known geometry is used; typically, this is a Berkovich tip, which has a three-sided pyramid shape. The area of the indent is calculated using the known geometry of the indentation tip after a record of the depth of penetration is made during the instrumented indentation procedure.

Topics Covered in Nanoindentation

Topic 01

Elastic Modulus Extraction

Topic 02

Pile-up and Sink-in Analysis

Topic 03

Thin Film Hardness Measurement

Topic 04

Strain Rate Sensitivity Testing

Topic 05

Indenter Tip Calibration

Topic 06

Viscoelastic Property Characterization

Related Scientific Sessions at Materials 2027

Why Attend the Nanoindentation Conference 2027

Earn CPD Credit

Sessions are CPD-accredited; certificates issued to every registered delegate within two weeks of the conference.

Present Your Research

Oral and poster slots for original Nanoindentation work, reviewed by the scientific committee.

Network Globally

Meet materials researchers, engineers, and academics from around the world across three days.

Publish & Get Indexed

Accepted abstracts appear in the indexed conference proceedings with a citable DOI.

Learn from Keynotes

Plenary lectures from leading voices shaping Nanoindentation research and practice.

Hybrid Flexibility

Attend in person in Singapore or join virtually — same programme, same certificate.

Join Materials 2027 for the Nanoindentation track

Oral and poster slots for your work — in person in Singapore or online. Not presenting? Attend as a delegate to learn from the field.

Nanoindentation Conference 2027 — FAQs

What is the Nanoindentation track at Materials 2027?

The Nanoindentation track is a dedicated stream within Materials 2027 covering the latest research, methods, and applications in Nanoindentation. It brings together researchers, engineers, and academics for oral presentations, posters, and discussion.

Who should attend the Nanoindentation sessions?

Materials researchers, engineers, educators, doctoral students, and R&D leaders with an interest in Nanoindentation are all welcome — whether presenting or attending.

Can I present my research in the Nanoindentation track?

Yes. Submit an abstract for oral or poster presentation. All submissions are peer-reviewed by the scientific committee; accepted abstracts appear in the indexed proceedings.

Is virtual attendance available for Nanoindentation sessions?

Yes. Materials 2027 is a hybrid conference — attend the Nanoindentation track in person in Singapore or join live online, with on-demand access afterward.

Join the Materials 2027 delegation

Singapore · March 18–20, 2027· Hybrid · in-person & virtual

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Attend without presenting.

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